Boyd: New Rack Emulator Developed in Collaboration with NVIDIA Extends End-to-End AI Liquid Cooling Technologies Portfolio
October 21, 2025
Boyd, whose end-to-end artificial intelligence (AI) liquid cooling technologies make it easier for data center owners and operators to implement new AI infrastructure, recently announced it has developed a new rack simulating thermal testing tool to help end clients efficiently deploy liquid cooled data centers and improve time to market.
Boyd’s Rack Emulator simulates the pressure drop and heat dissipation of a server and uses automation to test coolant distribution units (CDUs) to validate thermal performance before connecting to data center equipment, such as NVIDIA GB200 NVL72 platforms.
The Boyd Rack Emulator is programmable and flexible to simulate any server. Connect to the liquid cooling system, input capacity and pressure drop protocols, and Boyd’s Rack Emulator operates like a server, simulating server protocols with automation. The Rack Emulator can additionally test electrical inputs to the server before the server is put in place. It is easy to operate without specialized training, making it easy to deploy at scale in data centers.
Functioning as a thermal load bank and server simulator packaged in a rack size, the Rack Emulator can conveniently fit within a server row minimizing the space required to do load bank testing and simplifying server simulations. It is easy to ship, store, and handle, contributing to overall lower total cost of ownership.
“Advanced AI data centers require innovative thermal technology to support high performance inference and training workloads,” says David Huang, Boyd President, Thermal Solutions Division. “Developed in collaboration with NVIDIA, Boyd’s programmable Rack Emulator is designed to speed time to deployment for liquid cooled NVIDIA Blackwell infrastructure.”
