Molex: New Integrated Optical Interconnect Solutions and High-Radix Optical Circuit Switch Platform Simplify AI Networking
Combination of Molex VersaBeam EBO Backplane Connector and Teramount TeraVERSE detachable fiber connector boosts serviceability and slashes deployment time by 85%.
Molex, a global electronics leader and connectivity innovator, has unveiled a robust product roadmap for delivering the full technology stack needed to address the massive scaling requirements of hyperscale data centers. Molex has expanded its Co-Packaged Optics (CPO) interconnect toolkit designed to eliminate the most critical bottlenecks in AI cluster scaling. Additionally, Molex has introduced the High-Radix Optical Circuit Switch (OCS) Platform to deliver a complete optical switching fabric to meet emerging data requirements. By providing flexible, high-density optical switching, AI infrastructure operators are able to dynamically reconfigure network topologies and maximize utilization of valuable compute resources.
“The rapid growth of artificial intelligence, from large‑scale model training to real‑time inference, is placing unprecedented demands on data‑center networks,” said Peter Lee, vice president and general manager, Optical Solutions Business Unit, Molex. “Our goal is to deliver comprehensive and differentiating optical solutions that support the next generation of AI infrastructure—enabling greater scalability, improved operational efficiency and significantly enhanced energy efficiency as data center networking demands continue to accelerate.”
Maximizing Scale-Up Density
Building on the success of the award-winning VersaBeam EBO interconnect solutions, Molex has introduced the VersaBeam EBO Backplane Connector. This solution consolidates up to 192 fibers into a single, compact interface. By moving connectivity to a pre-configured optical backplane, this new product enables “blind” installation of cards and sleds forming optical connections in mass and utilizes Expanded Beam Optical (EBO) technology to reduce sensitivity to dust and debris. The result dramatically reduces cleaning, inspection and maintenance requirements, slashing deployment time by up to 85%.
Additional performance benefits are realized when pairing the high-capacity transport of the Molex VersaBeam EBO Backplane Connector with the Teramount TeraVERSE® detachable fiber connectivity product. Molex is collaborating with Teramount to commercialize the highly innovative TeraVERSE separable, serviceable fiber-to-chip interface. Together, these solutions provide a continuous, high-performance optical path that allows for a modular “swappable” architecture that helps minimize damage to delicate fiber interfaces or the need for onsite optical expertise.
“This collaboration is a gamechanger for our industry,” said Hesham Taha, CEO and co-founder at Teramount. “By combining the proven interconnect expertise that Molex brings with Teramount’s breakthrough detachable-fiber and optical-coupling connectivity, we’re enabling hyperscalers to accelerate deployment of flexible, high-performance optical solutions.”
Meeting Demands for Next-Generation Architectures
As part of its one-stop solution set that alleviates growing demands for bandwidth, power optimization and thermal efficiency, the Molex CPO toolkit includes a Versatile Format Interconnect (VFI) Optical Backplane System and External Laser Source Small Form Factor Pluggable (ELSFP) Optical Connectors. The enhanced Molex VFI offers up to a 50% density boost to maximize space utilization. Complementing this, the Molex ELSFP solution moves laser power sources off the chip for more reliable CPO connections. Fully compliant with and licensed under the Optical Internetworking Forum (OIF) 2.0 CPO standards, the Molex ELSFP helps improve reliability, testing and deployment.
Reconfigurable High‑Radix Optical Switching for AI Infrastructure
To address the architectural demands of large‑scale AI and machine‑learning clusters, Molex has unveiled the High‑Radix OCS Platform. Built on more than 20 years of MEMS expertise, a broad portfolio of patented technologies, and over two million deployments of MEMS-based devices, this all‑optical switching platform enables dynamic, fiber‑level reconfiguration without the need for power‑intensive optical‑electrical‑optical (O‑E‑O) conversion. Bypassing traditional electrical switching layers, the OCS reduces power consumption and thermal load while simplifying network architectures. This high‑radix optical fabric supports flatter, more efficient interconnect topologies well suited for AI training and inferencing—enabling scalable, reconfigurable connectivity as compute density increases and link speeds continue to evolve.
More information about the Versatile Format Interconnect (VFI) Optical Backplane System from Molex
More information about the External Laser Source Small Form Factor Pluggable (ELSFP) Optical Connectors from Molex
