Panduit to Showcase Integrated AI and Data Center Infrastructure Solutions at SC26
November 3, 2026
Panduit will present its portfolio of technologies for HPC and AI environments at SC26 (Supercomputing 2026), The International Conference for High Performance Computing, Networking, Storage, and Analysis, Nov. 15 – 20 at McCormick Place in Chicago. At booth #4000, Panduit will demonstrate how power, cooling, connectivity, resiliency, and visibility work together to help organizations scale next-generation computing environments.
As HPC and AI workloads drive greater compute capacity, power consumption, and density, the physical systems supporting them have become increasingly critical. Organizations must manage rising thermal loads, deliver reliable power, accommodate high-density connectivity, and maintain visibility into essential equipment. Panduit helps address these interconnected challenges with an integrated portfolio spanning cabinets designed for Direct-to-Chip (DTC) cooling solutions, fiber connectivity, power distribution, and rack-level monitoring and management.
“AI and HPC are raising the demands placed on the physical infrastructure that supports computing environments,” said Tom Kelly, CTO, Panduit. “At SC26, Panduit is demonstrating how power, cooling, connectivity, and infrastructure management work collectively to help customers meet today’s requirements and adapt as compute capacity and power density continue to grow.”
At the Panduit booth (#4000), attendees can explore the following technologies:
- Panduit and SEGUENTE DTC Cooling Solutions: The Panduit FlexFusion DTC Cooling Cabinet provides an integrated platform combining cooling, power distribution, and cable management within a standard rack footprint. In coordination with featured partner SEGUENTE, Panduit will demonstrate how advanced two-phase DTC cooling can support higher-density AI and HPC data center deployments while improving efficiency and infrastructure scalability with reduced operational complexity. The demonstration will feature SEGUENTE’s COLDWARE platform, which combines two-phase liquid-cooled IT hardware with intelligent AI-based software for monitoring, operational visibility, and infrastructure management.
- Fiber Connectivity and Expansion: Panduit will showcase technologies for high-density fiber connectivity and organization, including the HD Fusion Fiber Wall Mount Splice Enclosure, which supports 864 to 3,456 fibers within the same footprint. Other featured solutions include PanMPO connectivity, a toolless option to change gender and polarity in the field; High Density Consolidation Point (HDCP), an in-cabinet cable manager; Bundled Interconnects, which support superpod buildouts; a new foldable trunk option; MMC connectivity solutions; and Shuffle Solutions.
- Power Distribution and Infrastructure Management: Panduit will demonstrate its EL2P and ES2P power distribution units (PDUs), UPS systems, environmental sensors, and rack access control technologies. Collectively, these offerings help deliver reliable power, provide insight into rack conditions, and give operators greater control over critical equipment.
- Cable Pathways: Panduit will feature its FiberRunner cable routing system, which helps organize and protect fiber cabling while supporting efficient cable management as high-density AI and data center connectivity requirements grow.
In addition, Panduit will highlight its Quick Ship Fiber Program, which offers pre-qualified, end-to-end fiber configurations that ship within 10 business days of request. Select assemblies include LC patch cords, PanMPO interconnects, and trunk cables, helping customers reduce lead-time delays and get products directly to job sites.
Attendees can visit Panduit at booth #4000 at SC26 on Tuesday, Nov. 17 and Wednesday, Nov. 18 from 10 a.m. to 6 p.m. CST and Thursday, Nov. 19 from 10 a.m. to 3 p.m. CST at McCormick Place in Chicago.
