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    Quantum Sensing: The Next Leap for IoT

    September 9, 2026 By Filippo Di Giovanni Quantum-mechanical concepts have proved fundamental to emerging breakthrough technologies such as quantum computing (QC). Now, the same principles are driving a new branch in sensing technology.  Quantum sensors (QSs) exploit direct quantum phenomena to measure physical quantities with unmatched level of precision. Unlike quantum-inspired algorithms, which run on…

    Liquid Cooling: Redesigning the Thermal Architecture of AI Data Centers

    September 9, 2026 The rapid deployment of AI accelerators is changing one of the fundamental design constraints of the data center: thermal management. As GPUs and CPUs become more powerful and rack-level power density continues to increase, conventional air cooling is approaching the limits of what it can practically remove from high-density computing systems. Liquid…

    Hints on Effective Cooling of High-Power PCBs

    August 27, 2026 Heat poses a real threat to the longevity and reliability of any electrical circuit. When subjected to excessive thermal stress, PCB materials and power components can drift outside the operating conditions they were designed for. Consequently, thermal management becomes a critical consideration when designing PCBs that incorporate high-power devices. For this reason,…

    Wide Bandgap Materials in Hybrid and Electric Vehicles

    August 27, 2026 Introduction For decades, power electronics have relied predominantly on silicon, a semiconductor material that lends itself to essentially defect-free processing. Silicon’s theoretical performance ceiling, however, has now largely been reached, exposing several shortcomings: constrained voltage-blocking capacity, limited thermal dissipation, capped efficiency, and non-trivial conduction losses. Wide bandgap (WBG) semiconductors — chiefly silicon…

    800 VDC and the Race to Power the AI Factory

    August 27, 2026 By: Maurizio Di Paolo Emilio, Contributing Editor at Panel Builder US Artificial intelligence is pushing data-center power architectures into territory they were never designed to handle. As AI accelerators become more powerful, rack power is moving from tens of kilowatts toward hundreds of kilowatts and, ultimately, the 1 MW range. At that…

    Data Center Market Trends: 10 Questions with Weidmuller

    August 13, 2026 Data centers are evolving faster than ever — driven by rising energy demands, the push for sustainability, and the integration of AI and edge computing. To better understand how these shifts are shaping data center infrastructure, operations, and connectivity, Data Centre Digest editor Garth Miller interviewed Pete Tecos, Director of Data Centers…

    Powering the AI Factory: The Role of 800 VDC Distribution and ISOP Converters in Next-Generation Data Centers

    August 13, 2026 By: Maurizio Di Paolo Emilio, Contributing Editor at Data Centre Digest Artificial intelligence workloads are rapidly reshaping data center power architectures. Conventional server infrastructure was not originally designed to sustain today’s extreme compute density requirements. As a result, modern facilities increasingly resemble “AI factories,” where maximizing computational throughput per rack is a…

    ABB Powers Up: Key Factors for Higher-Voltage MV Systems in AI Data Centers

    August 13, 2026 By Dr. Harsh Karandikar and Yasir Shinaishin, ABB The power density and scale of AI computing deployments are changing every aspect of how data centers are designed and operated. For decades, data centers had total IT loads measured in MWs and were built to support IT environments operating at less than 30…

    Rethinking Power Delivery for AI-Scale Data Centers

    August 13, 2026 By Sasha Ishmael, Principal Engineer, Technology and Industry Solutions, VEIR The data center industry is attempting to scale AI infrastructure with power delivery architectures designed for a fundamentally different era of compute density. AI workloads are accelerating demand for larger campuses, higher rack densities, faster deployment timelines, and increasingly complex electrical and…

    POWERDIGEST Contributing Editor

    Maurizio Di Paolo Emilio

    Maurizio Di Paolo Emilio holds a Ph.D. in Physics and is a Telecommunications Engineer. He is Director of Global Marketing Communications at EPC (Efficient Power Conversion), where he manages worldwide initiatives to showcase the company’s GaN innovations. He is a prolific technical author of books on GaN, SiC, energy harvesting, and data acquisition and control systems, and has extensive experience as an editor for technical magazines and online publications in power electronics, wide bandgap semiconductors, and embedded systems.