Eaton Expands Modular Data Center Offering for Rapid Deployment of AI Factories From Grid to Chip
February 2, 2026
Eaton is collaborating with Flexnode, an innovative digital infrastructure company, to deliver modular, scalable rack and power infrastructure for data center compute applications.
Eaton will supply critical power backup, racks and cable management technologies for Flexnode’s modules that help data centers reduce deployment schedules by 35% on average. Additionally, Eaton led Flexnode’s Series A round to further accelerate its approach to data center infrastructure.
As large-scale data center buildouts approach gigawatt-level power demands, high-density power, cooling and compute infrastructure requires a more efficient and scalable approach. Eaton brings complete, future-proof systems and enables modular, cost-effective production that reduces time to build and onsite labor requirements. The company’s collaboration with Flexnode expands Eaton’s modular offering in the U.S., which includes its Fibrebond business’ pre-integrated enclosures for data center power infrastructure.
“As AI, high-performance computing (HPC) and quantum workloads push rack densities beyond one megawatt, Eaton’s modular strategy provides IT and power infrastructure that’s efficient, adaptive to dynamic load profiles, and enables scalable, repeatable builds across diverse geographies,” said Linsey Miller, senior vice president and general manager of Distributed IT at Eaton. “Our collaboration with Flexnode expands our grid-to-chip data center approach and allows us to help customers deploy data center infrastructure faster by going fully modular.”
“AI factory infrastructure requires the most advanced levels of architecture, engineering and construction,” said Andrew Lindsey, CEO of Flexnode. “With Eaton, we will automate deployments using Flexnode’s flexible modular building platform to meet the urgency, precision and scale requirements of modern AI workloads today and tomorrow.”
Together, Eaton and Flexnode will offer turnkey, prefabricated IT infrastructure purpose-built for high power density data halls from 3.5 to 35 megawatts, and the ability to deploy multiple data halls onsite. The collaboration couples Eaton’s technologies and 800 VDC power infrastructure with Flexnode’s modular construction from design to deployment. Eaton technologies will be integrated into the Flexnode NX Compute Module, for rapid deployment to support the most demanding compute requirements.
